Colour shows the relationship, the line its evidence: solid documented, dashed reported, dotted inferred, faint with ? a hypothesis. Square corners are listed companies, round ones private; a red dashed box is a gap. Full legend below the map.
The map as text
Every company by stage and segment, each with the ties it supplies, and what each tie rests on.
Materials
networking · 2
- Corning · GLW · United States
- Yangtze Optical Fibre and Cable (长飞光纤) · 601869.SH · China
- Competitor → Corning: Optical fiber and data-center cable · not graded
power · 6
- Daiichi Kigenso Kagaku Kogyo · 4082 · Japan
- Supplies material → Bloom Energy: Supplies materials (zirconia powder) · reported
- DKK's Chinese partner · private · China
- Supplies material → Daiichi Kigenso Kagaku Kogyo: Scandium oxide · documented
- Hunan Oriental Scandium · private · China
- Supplies material → Bloom Energy: Supplies materials (scandium oxide) · reported
- KV Materials · private · South Korea
- Supplies material → Amosense: Electrolyte raw materials · reported
- Rio Tinto · RIO · Canada
- Supplies material → Bloom Energy: Possible supplier of materials (scandium oxide) · hypothesis, not on record
- Sumitomo Metal Mining · 5713 · Japan
- Supplies material → Bloom Energy: Possible supplier of materials (scandium oxide) · hypothesis, not on record
Fabrication
compute · 3
- TSMC · TSM · Taiwan
- Manufactures for → NVIDIA: Manufactures for (advanced-node wafers and packaging) · documented
- Manufactures for → AMD: Manufactures for (advanced-node wafers) · documented
- Manufactures for → Broadcom: Manufactures for (advanced-node wafers) · documented
- Manufactures for → Marvell Technology: Possible foundry supplier (wafers) · hypothesis, not on record
- Manufactures for → Apple: advanced-node wafers for Apple silicon · hypothesis, not on record
- Manufactures for → Tesla: FSD and AI chips · hypothesis, not on record
- Manufactures for → Microsoft: Manufactures for (Maia 200 chips on 3nm) · documented
- Victory Giant Technology · 300476.SZ · China
- Supplies components → NVIDIA: Supplies components (high-layer AI server boards) · inferred
- WUS Printed Circuit · 002463.SZ · China
- Supplies components → NVIDIA: Supplies components (AI server and switch boards) · inferred
custom silicon · 1
- Tongfu Microelectronics · 002156.SZ · China
- Manufactures for → AMD: Manufactures for (advanced packaging and test) · documented
Chips and components
compute · 2
- AMD · AMD · United States
- Supplies components → OpenAI: Supplies components (Instinct GPUs, a 6 GW agreement) · documented
- Supplies components → Meta Platforms: Supplies components (Instinct GPUs, up to 6 GW) · documented
- Supplies components → Microsoft: Supplies components (GPUs for Azure) · documented
- Supplies components → Tesla: AMD processors in vehicle infotainment · hypothesis, not on record
- NVIDIA · NVDA · United States
- Supplies components → Hon Hai Precision: Supplies components (GPUs and rack designs for assembly) · inferred
- Supplies components → Quanta Computer: Supplies components (GPUs and rack designs for assembly) · inferred
- Supplies components → OpenAI: Supplies components (systems, a 10 GW letter of intent) · documented
- Supplies components → Meta Platforms: Supplies components (H100 GPUs) · documented
- Supplies components → Microsoft: Supplies components (GPUs for Azure) · documented
- Supplies components → Amazon: Supplies components (GPUs, 2 million more in 2027-2028) · documented
- Supplies components → Alphabet: Supplies components (GPUs for Google Cloud) · documented
- Supplies components → Tesla: NVIDIA GPUs for training clusters · hypothesis, not on record
custom silicon · 1
- Broadcom · AVGO · United States
- Supplies components → OpenAI: Supplies components (custom accelerators) · documented
- Supplies components → Apple: Supplies components (radio-frequency parts) · documented
- Supplies components → Alphabet: TPU custom silicon · hypothesis, not on record
- Supplies components → Meta Platforms: MTIA custom silicon · hypothesis, not on record
memory · 1
- Micron Technology · MU · United States
- Supplies components → Biwin Storage: Supplies components (memory wafers) · inferred
- Supplies components → Longsys: Supplies components (memory wafers) · inferred
networking · 5
- Coherent · COHR · United States
- Supplies components → Zhongji Innolight: Possible supplier to Innolight (laser and optical parts) · hypothesis, not on record
- Credo · CRDO · United States
- Supplies components → CIG Shanghai: Possible second DSP source for CIG Shanghai · hypothesis, not on record
- Supplies components → Amazon: active electrical cables for AI clusters · hypothesis, not on record
- Supplies components → Meta Platforms: active electrical cables for AI clusters · hypothesis, not on record
- Lumentum · LITE · United States
- Supplies components → Zhongji Innolight: Possible supplier to Innolight (lasers) · hypothesis, not on record
- Supplies components → Eoptolink Technology: Possible supplier to Eoptolink (lasers) · hypothesis, not on record
- MACOM · MTSI · United States
- Supplies components → Zhongji Innolight: Possible supplier to Innolight (amplifier and driver chips) · hypothesis, not on record
- Marvell Technology · MRVL · United States
- Customer → Zhongji Innolight: Customer (buys DSP chips; vendor unnamed) · inferred
- Customer → Eoptolink Technology: Customer (buys DSP chips; vendor unnamed) · inferred
- Customer → Accelink Technologies: Customer (buys DSP chips; vendor unnamed) · inferred
- Customer → HG Technology (华工正源): Customer (buys DSP chips; vendor unnamed) · inferred
- Customer → CIG Shanghai: Customer (buys DSP chips; vendor unnamed) · inferred
- Customer → Amazon: Customer (five-year multi-generational agreement) · documented
- Customer → Microsoft: Possible customer (custom silicon) · hypothesis, not on record
power · 4
- Amosense · private · South Korea
- Supplies components → Bloom Energy: Electrolyte substrates · reported
- Chaozhou Three-Circle · 300408.SZ · China
- Supplies components → Bloom Energy: Manufactures components (ceramic separator sheets) · inferred
- Envicool · 002837.SZ · China
- Competitor → Vertiv: Liquid-cooling distribution units and thermal management for AI data centers · not graded
- Megmeet · 002851.SZ · China
- Supplies components → NVIDIA: Supplies components (AI server power) · documented
Modules and assembly
memory · 2
- Biwin Storage · 688525.SH · China
- Longsys · 301308.SZ · China
networking · 7
- Accelink Technologies · 002281.SZ · China
- Competitor → Coherent: Competitor of Accelink (optical components) · inferred
- Applied Optoelectronics · AAOI · United States
- CIG Shanghai · 603083.SH · China
- Eoptolink Technology · 300502.SZ · China
- Competitor → Applied Optoelectronics: 400G/800G transceivers for hyperscalers · not graded
- Fabrinet · FN · United States
- HG Technology (华工正源) · 000988.SZ · China
- Zhongji Innolight · 300308.SZ · China
- Competitor → Coherent: Competitor of Innolight (datacom transceivers) · inferred
- Competitor → Fabrinet: 800G/1.6T transceiver manufacturing for the same demand (contract manufacturing against in-house Thai plants) · not graded
systems · 3
- Hon Hai Precision · 2317.TW · Taiwan
- Quanta Computer · 2382.TW · Taiwan
- Competitor → Dell Technologies: AI servers for enterprises and hyperscalers (branded versus ODM) · not graded
- Wiwynn · 6669.TW · Taiwan
- Competitor → Super Micro Computer: AI servers and racks for the same hyperscalers · not graded
Systems and equipment
networking · 2
- Ciena · CIEN · United States
- ZTE · 000063.SZ · China
- Competitor → Ciena: Coherent optical transport (800G ZR/ZR+, DCI) sold to the same carriers and hyperscalers · not graded
systems · 2
- Dell Technologies · DELL · United States
- Supplies components → Microsoft: AI servers · hypothesis, not on record
- Super Micro Computer · SMCI · United States
- Supplies components → Microsoft: AI servers · hypothesis, not on record
power · 3
- Bloom Energy · BE · United States
- Customer → American Electric Power: Customer (fuel-cell procurement agreement) · documented
- Partner → Oracle: Deployment partner (fuel cells at Oracle data centres) · documented
- Customer → Equinix: Customer (fuel cells at Equinix data centres) · documented
- Customer → Korea Southern Power: Downstream user (electrolyser project through SK ecoplant) · documented
- Partner → SK ecoplant: Distribution partner (South Korea) · documented
- Partner → SK eternix: Distribution partner (South Korea) · documented
- Partner → Brookfield Asset Management: Financing partner (deployment framework) · documented
- Partner → Baker Hughes: Collaboration partner (power and hydrogen) · documented
- Competitor → FuelCell Energy: Competitor (stationary fuel cells) · inferred
- FuelCell Energy · FCEL · United States
- Vertiv · VRT · United States
Customers and operators
compute · 4
- Alphabet · GOOGL · United States
- Meta Platforms · META · United States
- OpenAI · private · United States
- Tesla · TSLA · United States
custom silicon · 1
- Amazon · AMZN · United States
systems · 1
- Microsoft · MSFT · United States
- Partner → OpenAI: Partner (Azure capacity and investment) · documented
power · 8
- American Electric Power · AEP · United States
- Baker Hughes · BKR · United States
- Brookfield Asset Management · BAM · United States
- Equinix · EQIX · United States
- Korea Southern Power · private · South Korea
- Oracle · ORCL · United States
- Customer → OpenAI: Downstream user (cloud capacity from Oracle) · documented
- SK ecoplant · private · South Korea
- SK eternix · private · South Korea
other · 1
- Apple · AAPL · United States
Gaps
- Gap upstream of Daiichi Kigenso Kagaku Kogyo: Where DKK's scandium for Bloom-bound powder comes from, beyond the 2023 purchase
- Gap upstream of Chaozhou Three-Circle: Who supplies the powder and scandium in the separator sheets
- Gap upstream of KV Materials: Where the scandium KV Materials buys comes from
- Gap upstream of Zhongji Innolight: Who makes the DSP chips in Innolight's optical modules
- Gap upstream of Eoptolink Technology: Who makes the DSP chips in Eoptolink's optical modules
- Gap upstream of Accelink Technologies: Who makes the DSP chips Accelink buys in
- Gap upstream of HG Technology (华工正源): Who makes the overseas high-end DSP chips in HG Technology's modules
- Gap upstream of CIG Shanghai: Who makes CIG Shanghai's DSP chips
- Gap upstream of Zhongji Innolight: Who supplies the lasers and optical chips in Innolight's modules
- Gap upstream of Eoptolink Technology: Who supplies the lasers in Eoptolink's modules